Product Overview

Switch Motherboard is the core functional board of networking switch equipment. It is used to host the switch ASIC, high-speed PHY chips, memory, and power management modules, enabling high-speed packet forwarding and network communication control.

This type of board is typically designed with high-speed multi-layer PCB technology, using low-loss materials and precision routing processes to ensure signal integrity (SI) and power integrity (PI).

Switch motherboards are widely used in enterprise switches, data center switching equipment, industrial network systems, and communication infrastructure, making them a critical hardware platform in modern network architecture.

Product Features

Supports high-speed data transmission (10G / 25G / 100G / 400G)
High-layer PCB design (8–32 layers or more)
Strict impedance control (Differential / Single-ended Impedance Control)
Low-loss materials (Low Dk / Low Df)
Optimized power integrity (PI design optimization)
Supports large-scale data switching and parallel processing
Excellent thermal and structural design optimization
High reliability for 7×24-hour continuous operation
Supports high-speed interfaces: Ethernet / SFP / QSFP / PCIe, etc.

Application Fields

Enterprise Network Switches
Data Center Switches
Cloud Computing Infrastructure
Telecommunication Systems
Industrial Ethernet Switches
Network Security Devices
Core Routing & Switching Platforms
Smart City Network Infrastructure
AI Server Networking Systems

Product Parameters (Example)

Item	Specification
PCB Layers	8–32 layers (customizable higher)
Material Type	High-Speed FR4 / Rogers / Megtron
Min. Trace Width/Spacing	3/3 mil or smaller
Impedance Control	±5% tolerance
Signal Speed	1G–400G+
Copper Thickness	0.5–2 oz
Surface Finish	ENIG / Immersion Silver / OSP
Operating Temperature	-40°C ~ 85°C (industrial grade expandable)
High-Speed Interface Support	SFP / SFP+ / QSFP / QSFP-DD

Product Advantages (Compared to Standard PCBs)

Item	Switch Motherboard	Standard PCB
High-Speed Capability	⭐⭐⭐⭐⭐	⭐⭐
Impedance Control Accuracy	⭐⭐⭐⭐⭐	⭐⭐
Multi-Layer Design Complexity	⭐⭐⭐⭐⭐	⭐⭐⭐
Signal Integrity (SI)	⭐⭐⭐⭐⭐	⭐⭐
Power Integrity (PI)	⭐⭐⭐⭐⭐	⭐⭐⭐
Data Processing Capability	⭐⭐⭐⭐⭐	⭐⭐
Cost	⭐⭐⭐	⭐⭐⭐⭐⭐