SMT Assembly Line
A fully controlled 30-step SMT process with 4 IPQC checkpoints - ensuring zero-defect assembly from order to shipment.
There are currently 6 SMT lines, equipped with new imported Yamaha machine, automatic solder paste printer, SPI solder paste detector, ten temperature zone reflow furnace, Online AOI, X-ray lines and other high-end equipment, with a mounting capacity of 8 million solder joints/day, especially good at high precision, high complexity of the single board, with the production of 40000 + solder joints of ultra-complex single board actual performance.
| SMT Capacity | 8 million solder joints/day |
| SMT Lines | 6 high-speed patch lines, 1 patch proofing line |
| Throwing Rate | Resistance capacitance ratio 0.3% |
| IC type non throwing material | |
| Board Type | POP/Common Board/FPC/Rigid-Flex Board/Metal Base Board |
| Specifications of Mounting Components | Stickable Minimum Package | 03015 Chip/0.35 Pitch BGA |
| Minimum Device Accuracy | ±0.04mm | |
| IC Chip Precision | ±0.03mm | |
| Specifications of Mounting PCB | PCB Size | 50*50mm – 774*710mm |
| PCB Thickness | 0.3-6.5mm |
3D SPI
The new SPI can accurately detect the solder paste printing defects such as excessive/insufficient tin, missing printing offset, etc., to ensure the quality.
Online AOI
Newly updated AOI can accurately detect the mounting problems of components such as wrong parts, missing parts and reverse direction, and the welding quality.
3D X-ray
Inspect the solder situation of components, from three-dimensional, like BGA, and reproduce the internal structure in all directions without blind spots.
Smart First-Piece Tester
Test the first sample according to the production data to ensure that the sample quality and function are consistent, and ensure the project promoting smoothly.
One-Stop Service
High-speed and high-precision reliability equipment, supporting testing and assembly production lines, providing one-stop PCBA OEM services for PCB manufacturing, SMT processing, stencil, components sourcing, DIP plug-in post welding, function test and final assembly.
Raw Material Guarantee
Adhere to guarantee the quality from the source, use the solder paste of Senju brand imported from Japan, purchase all electronic components from the original factory or the first level agent, and trace each material to the original factory to ensure the authenticity.
Quality Assurance
The production line is equipped with new SPI, AOI, 3D X-ray and First-Piece tester inspection equipment. During the production process, it will also undergo strict IPQC production inspection, QC manual inspection and QA delivery inspection to ensure that the delivered products are free of any quality problems.
Whole Process Follow-Up
Senior engineers and technical teams follow up the whole process of the project to solve various EQs in the production process of the project and ensure the best lead time.
Highly Cost-Effectivedelegation
From one piece to mass production, we can paste bulk materials, and the cost of each placement is as low as 0.0012 USD/point.
System Certification
Our factory has passed ISO9001, ISO14001, ISO13485, UL and other international quality management system certification, and the products meet RoHS environmental requirements.
