Jianhe Circuit Boards
Aluminum-based Copper-Clad Laminate (CCL) is a type of metal circuit board material composed of copper foil, a thermally conductive insulating layer, and a metal substrate. Its structure consists of three distinct layers:
Circuit Layer: Equivalent to the copper-clad layer found in standard PCBs; the thickness of the circuit copper foil typically ranges from 1 oz to 10 oz.
Insulating Layer: This layer consists of a thermally conductive insulating material characterized by low thermal resistance. With a thickness ranging from 0.003" to 0.006", this layer represents the core technology of the aluminum-based CCL and has obtained UL certification.
Base Layer: This serves as the metal substrate, typically composed of aluminum, though copper is also available as an alternative choice. Aluminum-based CCLs stand in contrast to traditional laminates, such as those made from epoxy-impregnated glass cloth.
An aluminum-based PCB comprises a circuit layer, a thermally conductive insulating layer, and a metal base layer. The circuit layer (i.e., the copper foil) is typically etched to form the printed circuitry that interconnects the various components. Generally, the circuit layer is required to possess high current-carrying capacity; consequently, thicker copper foil-typically ranging from 35 μm to 280 μm in thickness-is utilized.
The thermally conductive insulating layer constitutes the core technology of the aluminum-based PCB. It is typically composed of a specialized polymer matrix filled with specific ceramic particles. This layer exhibits low thermal resistance, excellent viscoelastic properties, resistance to thermal aging, and the ability to withstand both mechanical and thermal stresses. The insulating layers found in high-performance aluminum-based PCBs-such as models IMS-H01, IMS-H02, and LED-0601-employ precisely this technology, thereby endowing them with exceptionally superior thermal conductivity and robust electrical insulation capabilities.
The metal base layer serves as the structural support for the aluminum substrate and is required to possess high thermal conductivity. It typically consists of an aluminum plate, although a copper plate (which offers even superior thermal conductivity) may also be used. This base layer is compatible with standard mechanical processing techniques, such as drilling, punching, shearing, and cutting. Compared to conventional PCB materials, aluminum-based substrates offer unparalleled advantages. They are ideally suited for Surface Mount Technology (SMT) processes involving power components. By eliminating the need for external heat sinks, they allow for significantly reduced product dimensions while delivering exceptional heat dissipation, as well as excellent electrical insulation and mechanical properties.
