Product Overview

Ceramic Circuit Boards are high-reliability electronic circuit carriers manufactured using advanced processes such as thick-film, thin-film, Direct Plated Copper (DPC), Direct Bonded Copper (DBC), and Active Metal Brazing (AMB), with high-performance ceramic materials including aluminum oxide (Al₂O₃), aluminum nitride (AlN), and silicon nitride (Si₃N₄) as substrates.

Compared with traditional FR4 PCBs or metal-based substrates, Ceramic Circuit Boards offer extremely high thermal conductivity, excellent electrical insulation, and outstanding high-temperature stability, enabling stable operation under extreme conditions.

In high-frequency and communication applications, 5G Base Station Ceramic PCB has become critical core components in power amplifiers, RF modules, and high-power-density communication devices, particularly suitable for high-frequency, high-speed, and high-heat-dissipation scenarios.

Ceramic Circuit Boards are widely used in 5G communications, power electronics, aerospace, automotive electronics, and high-end industrial equipment, making them a key foundational material for next-generation high-reliability electronic systems.

Product Features

Ultra-high thermal conductivity (up to 24–200 W/m·K+)
Excellent electrical insulation and low dielectric loss
Exceptional high-temperature stability (long-term operation above 300°C)
Low high-frequency signal loss, suitable for RF/microwave applications
Low thermal expansion coefficient, compatible with chip packaging
Excellent corrosion and aging resistance
Supports high power density design
Suitable for extreme environment electronic systems

Application Areas

5G Base Station RF Modules

Power Electronics

Aerospace & Defense Systems

Automotive Electronics / EV Power Modules

High-Frequency Communication Systems

High-Power LED Lighting

Medical Laser Equipment

Industrial High-Temperature Control Systems

Product Parameters (Example)

Item	Specification
Substrate	Al₂O₃ / AlN / Si₃N₄
Process	DBC / DPC / Thick Film / Thin Film
Board Thickness	0.25–3.0 mm
Min. Line Width/Spacing	2/2 mil (high-precision process)
Copper Thickness	0.5–10 oz
Thermal Conductivity	24–200 W/m·K
Dielectric Constant	6–9 (material dependent)
Operating Temperature	-55°C ~ 400°C
Surface Finish	ENIG / Ni-Au / Ag / Cu plating

Product Advantages (Compared with FR4 PCB)

Item	Ceramic Circuit Boards	FR4 PCB
Thermal Conductivity	⭐⭐⭐⭐⭐	⭐⭐
High-Temperature Stability	⭐⭐⭐⭐⭐	⭐⭐
High-Frequency Performance	⭐⭐⭐⭐⭐	⭐⭐⭐
Electrical Insulation	⭐⭐⭐⭐⭐	⭐⭐⭐
Power Handling Capability	⭐⭐⭐⭐⭐	⭐⭐⭐
Environmental Adaptability	⭐⭐⭐⭐⭐	⭐⭐⭐