Product Overview
Copper Core PCBs, also known as metal-core copper substrate circuit boards, are high-performance thermal management PCBs that use high-thermal-conductivity copper as the core substrate. They are fabricated by laminating an insulating dielectric layer and conductive circuit layers onto a copper core structure through high-precision bonding processes.
Compared with traditional FR4 PCBs, Copper Core PCBs offer significantly higher thermal conductivity and superior heat dissipation performance. They can rapidly transfer heat generated by electronic components into the copper structure, effectively reducing localized temperature rise and improving system stability and service life.
In high-power electronic applications, Power Supply Copper Substrates are a typical implementation, widely used in power modules, LED drivers, power conversion systems, and other scenarios requiring excellent thermal performance.
Copper Core PCBs are especially suitable for high power density, high thermal load, and high-reliability electronic products, making them a key solution in modern power electronics design.
Product Features
- Excellent thermal conductivity and rapid heat dissipation
- Reduced thermal resistance and extended component lifespan
- Suitable for high power density circuit designs
- Outstanding thermal cycling reliability
- Enhanced system stability and safety
- High current carrying capability
- Suitable for extreme operating environments
- Compatible with various surface finishing processes
Application Fields
- LED Lighting Systems (high-power LED lighting)
- Power Supply Modules
- Power Electronics Systems
- Automotive Power Units
- Industrial Power Control
- Renewable Energy Systems
- Communication Power Devices
- High-Power Amplifiers
- Smart Power Management Systems
Product Specifications (Example)
|
Item |
Specification |
|
Substrate |
Copper Core / Metal Core Copper Substrate |
|
Copper Core Thickness |
0.5–6.0 mm (customizable) |
|
Board Thickness |
0.8–5.0 mm |
|
Thermal Conductivity |
200–400 W/m·K (depending on structure) |
|
Min Line Width/Spacing |
4/4 mil |
|
Hole Diameter |
0.2 mm (smaller customizable) |
|
Surface Finish |
HASL / ENIG / OSP / Immersion Silver |
|
Dielectric Withstanding Voltage |
≥3kV |
|
Operating Temperature |
-40°C ~ 150°C |
Product Advantages (Compared with FR4 PCB)
|
Item |
Copper Core PCBs |
FR4 PCB |
|
Heat Dissipation |
⭐⭐⭐⭐⭐ |
⭐⭐ |
|
Power Handling |
⭐⭐⭐⭐⭐ |
⭐⭐ |
|
Thermal Stability |
⭐⭐⭐⭐⭐ |
⭐⭐ |
|
Reliability |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
|
High-Temperature Performance |
⭐⭐⭐⭐⭐ |
⭐⭐ |
Summary of Advantages
- Exceptional heat dissipation for high-power applications
- Effectively reduces thermal failure risk
- Improves overall system reliability
- Supports high current and high power design requirements
- Suitable for harsh industrial and automotive environments
- Optimized thermal management structure
- A core solution for power and power module applications
- Widely used in Power supply copper substrate structural designs
After-Sales & Technical Support
Thermal design and heat dissipation optimization support
DFM (Design for Manufacturability) analysis
Copper core thickness and structure selection guidance
Application solution consulting
Small-batch prototyping and fast delivery services
Reliability testing and thermal cycling validation support
Global supply chain and logistics support
Integrated solutions for power electronics systems
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