Product Overview
HDI PCBs (High-Density Interconnect Printed Circuit Boards) are advanced PCB structures that achieve high-density interconnection through the use of micro-vias, blind vias, buried vias, and high-precision routing technologies.
Compared with traditional multilayer PCBs, HDI PCBs provide higher wiring density per unit area, shorter signal paths, and superior electrical performance. They are especially suitable for high-speed, high-frequency, and highly integrated electronic product designs.
In flexible electronics and high-end miniaturized devices, Flexible HDI PCB combines HDI structures with flexible substrates, enabling bending, folding, and dynamic applications while maintaining high-density interconnect capability. They are widely used in wearable devices and space-constrained systems.
HDI PCBs have become a core circuit solution for smartphones, 5G communications, medical equipment, and high-end consumer electronics.
Product Features
- High-density routing capability for extreme miniaturization design
- Micro-via structure for improved interlayer interconnection efficiency
- Supports blind vias, buried vias, and stacked via designs
- Excellent signal integrity (SI) performance
- Reduced parasitic inductance and parasitic capacitance
- Strong electromagnetic compatibility (EMI/EMC) performance
- Supports high-speed digital and RF mixed design
- Supports rigid-flex structures
- Suitable for ultra-thin, highly integrated electronic systems
Applications
- Smartphones & Mobile Devices
- 5G Communication Modules
- Consumer Electronics
- Medical Imaging Devices
- Automotive Electronics / ADAS
- Wearable Devices
- Aerospace Electronics
- Industrial High-Speed Control Systems
- Flexible Electronics Systems
Product Specifications (Example)
|
Item |
Specification |
|
Layer Count |
4–20 layers (customizable higher-layer HDI structures available) |
|
Base Material |
FR4 / High-Tg FR4 / PI (Flexible HDI PCB) |
|
Board Thickness |
0.2–1.6 mm |
|
Minimum Trace/Space |
2/2 mil |
|
Micro-via |
0.075–0.1 mm laser drilling |
|
Via Structure |
Blind Via / Buried Via / Stacked Via |
|
Copper Thickness |
0.5–3 oz |
|
Surface Finish |
ENIG / ENEPIG / OSP / Immersion Silver |
|
Impedance Control |
±5% |
|
Operating Temperature |
-40°C ~ 125°C (material dependent) |
Product Advantages vs. Traditional Multilayer PCB
|
Item |
HDI PCBs |
Traditional Multilayer PCB |
|
Routing Density |
⭐⭐⭐⭐⭐ |
⭐⭐ |
|
Signal Integrity |
⭐⭐⭐⭐⭐ |
⭐⭐ |
|
Miniaturization Capability |
⭐⭐⭐⭐⭐ |
⭐⭐ |
|
High-Frequency Performance |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
|
EMI Control |
⭐⭐⭐⭐⭐ |
⭐⭐ |
|
Complex Design Capability |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
|
Flexible Expansion Capability |
⭐⭐⭐⭐ (Flexible HDI PCB better) |
⭐ |
Summary of Advantages
- Supports ultra-high-density interconnection and miniaturized design
- Improves high-speed signal transmission quality and stability
- Significantly reduces parasitic effects and signal loss
- Optimizes EMI/EMC performance for high-frequency applications
- Supports rigid, flexible, and rigid-flex structures
- Meets 5G and high-speed digital system design requirements
- Enhances overall system integration and reliability
- Suitable for high-end compact electronic product design
After-Sales & Technical Support
- HDI structure design and DFM (Design for Manufacturability) support
- Micro-via and stacked via design optimization guidance
- High-speed signal and impedance control optimization support
- Material selection and structural recommendations
- Stack-up design and simulation support
- Rapid prototyping and small-to-medium batch production services
- Reliability testing and process validation support
- Global delivery and supply chain support
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