Product Overview
Rigid-flex PCBs are a high-reliability electronic interconnection solution that integrates rigid PCBs and flexible PCBs into a single circuit structure through advanced lamination processes.
This structure combines the mechanical strength of rigid boards with the bendable characteristics of flexible circuits, enabling stable interconnection in complex three-dimensional spaces. It significantly reduces the use of connectors and wiring harnesses, thereby improving overall system reliability and integration.
In advanced electronic designs, Rigid-flex PCBs are often combined with high-density interconnect (HDI) technology, forming HDI rigid-flex PCB structures that enable finer traces, higher layer counts, and more complex routing requirements.
Rigid-flex PCBs can be designed as single-sided rigid-flex, double-sided rigid-flex, or multi-layer rigid-flex structures depending on application needs. They are widely used in high-reliability, miniaturized, and dynamic applications, and have become a core interconnection solution in modern high-end electronic products.
Product Features
- Combination of rigidity and flexibility, providing both structural support and bending capability
- Supports 3D space routing and complex structural designs
- High-reliability interconnection with reduced solder joints and connectors
- Supports high-density designs (HDI rigid-flex PCB enables ultra-fine routing)
- Excellent vibration and shock resistance
- Reduces system weight and overall size
- Improves assembly efficiency and structural stability
- Supports high-speed signal transmission and impedance control design
- Enables dynamic bending with long-term reliability
Application Fields
- Aerospace Electronics
- Medical Devices
- Military & Defense Systems
- Automotive Electronics
- Industrial Control Systems
- Camera Modules
- Robotics & Automation
- Smart Wearable Devices
- High-end Consumer Electronics
- Communication Equipment
Product Specifications (Example)
|
Item |
Specification |
|
Layer count |
2–12 layers (supports HDI rigid-flex PCB multi-layer structures) |
|
Rigid substrate |
FR4 / High-Tg FR4 / Rogers |
|
Flexible substrate |
PI (Polyimide) |
|
Board thickness |
0.2–3.0 mm |
|
Min. trace/space |
2/2 mil |
|
Min. hole size |
0.1 mm |
|
Copper thickness |
0.5–3 oz |
|
Surface finish |
ENIG / OSP / Immersion Silver / HASL |
|
Impedance control |
±5% |
|
Bending life |
≥50,000–200,000 cycles (structure dependent) |
|
Operating temperature |
-40°C ~ 125°C |
Product Advantages vs Traditional Rigid PCBs
|
Item |
Rigid-flex PCBs |
Traditional Rigid PCBs |
|
3D routing capability |
⭐⭐⭐⭐⭐ |
⭐⭐ |
|
Reliability |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
|
Space utilization |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
|
Connector dependency |
⭐ |
⭐⭐⭐⭐⭐ |
|
Vibration resistance |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
|
System integration level |
⭐⭐⭐⭐⭐ |
⭐⭐⭐ |
Summary of Advantages
- Enables stable interconnection in complex 3D structures
- Significantly reduces connectors and wiring harnesses, improving reliability
- Supports high-density routing and advanced fine-line design capability
- Improves device miniaturization and lightweight design
- Enhances vibration and environmental resistance
- Supports high-speed and high-frequency signal applications
- Increases overall system integration and assembly efficiency
- Meets the requirements of high-end electronics and precision equipment
After-Sales & Technical Support
- Rigid-flex structure design optimization support
- Stack-up and routing solution design
- DFM (Design for Manufacturability) analysis services
- Impedance control and high-speed signal optimization support
- Material selection and reliability recommendations
- Bend area design and lifecycle evaluation
- Fast prototyping and small-batch production support
- Global logistics and supply chain delivery support
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