Product Overview

Rigid-flex PCBs are a high-reliability electronic interconnection solution that integrates rigid PCBs and flexible PCBs into a single circuit structure through advanced lamination processes.

This structure combines the mechanical strength of rigid boards with the bendable characteristics of flexible circuits, enabling stable interconnection in complex three-dimensional spaces. It significantly reduces the use of connectors and wiring harnesses, thereby improving overall system reliability and integration.

In advanced electronic designs, Rigid-flex PCBs are often combined with high-density interconnect (HDI) technology, forming HDI rigid-flex PCB structures that enable finer traces, higher layer counts, and more complex routing requirements.

Rigid-flex PCBs can be designed as single-sided rigid-flex, double-sided rigid-flex, or multi-layer rigid-flex structures depending on application needs. They are widely used in high-reliability, miniaturized, and dynamic applications, and have become a core interconnection solution in modern high-end electronic products.

Product Features

Combination of rigidity and flexibility, providing both structural support and bending capability
Supports 3D space routing and complex structural designs
High-reliability interconnection with reduced solder joints and connectors
Supports high-density designs (HDI rigid-flex PCB enables ultra-fine routing)
Excellent vibration and shock resistance
Reduces system weight and overall size
Improves assembly efficiency and structural stability
Supports high-speed signal transmission and impedance control design
Enables dynamic bending with long-term reliability

Application Fields

Aerospace Electronics
Medical Devices
Military & Defense Systems
Automotive Electronics
Industrial Control Systems
Camera Modules
Robotics & Automation
Smart Wearable Devices
High-end Consumer Electronics
Communication Equipment

Product Specifications (Example)

Item	Specification
Layer count	2–12 layers (supports HDI rigid-flex PCB multi-layer structures)
Rigid substrate	FR4 / High-Tg FR4 / Rogers
Flexible substrate	PI (Polyimide)
Board thickness	0.2–3.0 mm
Min. trace/space	2/2 mil
Min. hole size	0.1 mm
Copper thickness	0.5–3 oz
Surface finish	ENIG / OSP / Immersion Silver / HASL
Impedance control	±5%
Bending life	≥50,000–200,000 cycles (structure dependent)
Operating temperature	-40°C ~ 125°C

Product Advantages vs Traditional Rigid PCBs

Item	Rigid-flex PCBs	Traditional Rigid PCBs
3D routing capability	⭐⭐⭐⭐⭐	⭐⭐
Reliability	⭐⭐⭐⭐⭐	⭐⭐⭐
Space utilization	⭐⭐⭐⭐⭐	⭐⭐⭐
Connector dependency	⭐	⭐⭐⭐⭐⭐
Vibration resistance	⭐⭐⭐⭐⭐	⭐⭐⭐
System integration level	⭐⭐⭐⭐⭐	⭐⭐⭐