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Engineering-grade thermal resistance for high-load, multi-reflow power and industrial hardware.
High Tg PCBs utilize modified epoxy resin systems with a glass transition temperature Tg >= 170°C (IPC-4101/126, /99 or equivalent high-performance specs). At temperatures exceeding Tg, standard FR-4 (Tg approx. 135°C – 140°C) shifts from a rigid glassy state to a rubbery state, accelerating Z-axis expansion and mechanical shear stress on plated-through holes (PTH). High Tg variants suppress Z-CTE (alpha_1: 45 – 50 ppm/°C; alpha_2: 220 – 250 ppm/°C) and elevate thermal decomposition threshold (Td >= 340°C).
Available Stackups: 1 to 24 layers (Rigid)
Standard Laminate Brands Stocked: Isola 370HR, Shengyi S1000-2, Panasonic R-1755 (or equivalent regional high-reliability equivalent upon BOM freeze)
Typical Z-axis expansion mitigation: Minimized barrel cracking through controlled drill-feed and direct metallization ratio >= 25 um copper wall thickness.
Engineering Support: Free stackup recommendation & DfM sign-off before tooling.
|
Parameter |
Specification Limit |
Standard / Test Method |
|
Glass Transition Temp (Tg) |
170°C to 210°C |
DSC (IPC-TM-650 2.4.25) |
|
Thermal Decomposition (Td) |
>= 340°C (5% wt loss) |
TGA |
|
Z-Axis CTE (alpha_1 / alpha_2) |
45 ppm/°C / 250 ppm/°C (50°C – 260°C) |
TMA (IPC-TM-650 2.4.24) |
|
Thermal Stress (Solder Float) |
288°C >= 300 seconds (no delamination) |
IPC-TM-650 2.4.13.1 |
|
Water Absorption |
<= 0.10% |
24-hr immersion |
|
Peel Strength |
>= 0.70 N/mm (1 oz copper) |
IPC-TM-650 2.4.8 |
|
Layer Count Range |
1 – 24 layers |
IPC-A-600 Class 2 / Class 3 |
|
Board Thickness |
0.40 mm <= T <= 3.20 mm |
Mechanical tolerance +/- 10% |
|
Min. Trace / Space (Inner/Outer) |
3.5 / 3.5 mil (90 / 90 um) |
Laser/LDI imaging |
|
Min. PTH Hole Size (Finished) |
0.15 mm (mechanical) / 0.10 mm (laser microvia) |
Aspect ratio up to 12:1 |
|
Surface Finishes |
ENIG, HASL-Lead Free, Immersion Silver, OSP, ENEPIG |
IPC-4552 / IPC-4554 |
Elevated Thermal Fatigue Resistance
Sustains > 1000 thermal cycles (-40°C to +125°C operational envelope) without barrel fatigue in heavy-copper power distributions.
Low Moisture-Induced Delamination
Modified dual-functional/multifunctional epoxy matrix prevents moisture-flash blistering during sequential lead-free reflow (260°C peak profile).
Controlled Impedance Tolerance
Dielectric constant (Dk = 4.2 – 4.4 at 1 GHz) tightly batch-controlled via resin-content verification (+/- 1.5%), supporting high-speed gate driver signals alongside power planes.
Heavy Copper Compatibility
Co-laminate capability up to 3 oz outer / 4 oz inner layers combined with thermal relief cavity milling.
|
Sector |
Specific Subsystem |
Thermal / Mechanical Stress Profile |
|
Power Electronics |
Switch-mode power supplies (SMPS > 2kW), inverter control boards |
Continuous ambient 85°C – 105°C, localized component hot-spots 130°C. |
|
Automotive |
On-board chargers (OBC), DC-DC converters, motor phase controllers |
Under-hood vibration profile, thermal shock cycling per AEC-Q100/103 environment expectations. |
|
Industrial Automation |
Servo drives, PLC backplanes, high-density industrial LED drivers |
Multi-shift continuous duty, high ambient cabinet temp (70°C internal rise). |
|
Telecommunications |
Base station RF power amplifier (PA) bias/control cards |
Mixed thermal density, tight microstrip impedance constraints. |
Stackup Customization: Hybrid stackups (High-Tg core + low-loss outer prepreg) available upon submission of layout cross-section requirements.
Copper Distribution: Asymmetric copper weighting balanced with thermal copper-thieving polygons to prevent bow-and-twist during pressing (< 0.5%).
Mask & Legend: LPI solder mask (Taiyo PSR-4000 series, green/black/matte black) + heat-cured white/yellow component legend; laser-scribed serial/batch UID matrix code.
Routing & Profiling: Routing router bit tolerance +/- 0.10 mm, V-score depth control +/- 0.1 mm remaining web thickness (1/3 to 1/2 board thickness).
Incoming Material Verification: DSC glass-transition verification on incoming laminate lot samples prior to inner-layer shear.
Inner-Layer Inspection: AOI (Automatic Optical Inspection) on 100% of inner layers for line width, etch residue, and microshorts.
Press-Fit / Stack Press Record: Traceable hydraulic press logs (temperature curve, ramp rate, holding pressure profile archived per batch ID).
Final Electrical & Destructive Test:
Compliance: IPC-A-600 Class 3 compliance audit trail available on request.
Manufacturing & Certifications
Facility Profile
Mid-to-high mix rigid PCB manufacturing plant, 45,000 m^2 monthly capacity footprint.
Process Execution & Verification Anchor
Visual / Analytical Proof: Batch microsection cross-section sample verified via optical metallography showing barrel copper wall thickness >= 25 um and void-free resin fill.
Primary Process Line Equipment
Direct Imaging (LDI) lines: Orbotech/Mania equivalent high-resolution exposure
Sequential lamination presses: Multidaylight vacuum thermal presses with closed-loop pressure feedback
Drilling: Schmoll high-speed multi-spindle CNC drills (> 150,000 RPM)
Certifications
ISO 9001:2015, IATF 16949:2016 (Automotive quality management scope), ISO 14001:2015, UL File No. E-prefix (UL94 V-0 flame rating certified laminate usage).
Packaging Standard
Vacuum-sealed ESD anti-static bags with moisture-indicator card (MIC) and silica gel desiccant packs (< 10% RH envelope), stacked in double-walled corrugated carton with custom foam corner dampening. Shelf life preservation: vacuum bag sealed up to 6 months.
Logistics & Volume Ramp Support
NPI Lead Time: 5 – 7 working days (panellized)
Volume Ramp-Up: 2 – 3 weeks post-First Article (FA) approval
Shipping: FOB / EXW / DDP via DHL/FedEx Express (prototypes) or air/sea freight palletized for volume production. Batch certificate of conformance (CoC) and material mill test report (MTR) included with every shipment box.
Submission Channel: Direct Engineering Mailbox (NDA protected): (or portal upload with auto-NDA token).
Required Package / Metadata: Gerber RS-274X or ODB++, centroid/pick-and-place file (if assembly required), IPC class requirement, target volume tier (NPI vs Batch), material Tg grade preference, surface finish, board stackup file/thickness constraint, target delivery date.
Engineering Review Turnaround: Free DfM query feedback, stackup sign-off notes, and line-item quotation delivered within 12 – 24 business hours.
With abundant experience, we are one of the most professional high tg pcbs manufacturers and suppliers in China. We warmly welcome you to buy bulk high quality high tg pcbs for sale here from our factory. If you have any enquiry about cooperation, please feel free to email us.
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