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Precision-engineered multilayer stackups for industrial, medical, and high-reliability OEM hardware. Built to IPC-A-600 Class 2/3. Impedance-controlled down to +/-10%. ITAR-exempt commercial supply chain.
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Parameter |
Specification Profile |
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Layer Count |
4 to 32 layers (even stackups standard; odd stackups on review) |
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Board Types |
Standard rigid, HDI (Any-layer / 1+N+1), High-frequency (Rogers/Taconic hybrid) |
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Standard Volume Lead Time |
Prototype: 5–7 days |
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Data Intake |
Gerber RS-274X, ODB++, IPC-2581; NC Drill (Excellon), IPC-D-356 netlist |
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Feature Category |
Production Capability / Limit |
Standard Tolerance / IPC Class |
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Finished Thickness |
0.4mm - 4.5mm |
+/-10% (overall) |
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Min Trace / Space |
3.0 mil / 3.0 mil (0.075mm / 0.075mm) |
+/-20% or +/-0.5 mil |
|
Min Laser Via (HDI) |
0.1mm (4 mil) blind/buried |
IPC-6012 Class 2/3 |
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Min Mechanical Hole |
0.15mm (6 mil) |
+/-0.05mm plated |
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Copper Weight (Inner/Outer) |
0.5 oz to 4 oz finished |
IPC-2221 compliance |
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Surface Finishes |
ENIG (IPC-4552), OSP (IPC-4553), Immersion Ag, Hard Gold (edge connectors) |
Thickness certified via XRF |
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Solder Mask |
LPI (Green, Black Matte, Blue, Red, White) |
IPC-SM-840E |
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Impedance Control |
Single-ended (50 ohm), Differential (90 ohm / 100 ohm) |
+/-10% TDR verified coupon |
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Base Laminate Materials |
Isola (FR408HR, 370HR), Ventec (VT-47), Panasonic (MEGTRON 6), Rogers (RO4350B) |
Tg >= 170 degC for high layer count |
Controlled Dielectric Stackup
Symmetric prepreg/core sequencing matched to TDR simulation reports prior to lamination press.
Via-in-Pad Electroplating
Resin-filled and copper-plated over via process for high-density BGA breakout (0.4mm pitch).
High-Tg Thermal Resilience
Thermal stress survival through 6x lead-free IR reflow profiles (260 degC peak) without delamination or barrel cracking.
Edge Plating / Castellated Holes
Plated half-holes (0.6mm min diameter) for daughter-to-motherboard vertical plug-in modules.
Industrial Automation: PLC backplanes, multi-axis motion controller boards (6–12 layers, heavy 2 oz power planes).
Telecommunications: Core switch linecards, high-frequency RF transceiver modules (hybrid FR4/Rogers 16–24 layers).
Medical Diagnostic Hardware: Ultrasound frontend signal processing, patient monitor data acquisition motherboards (low-noise ground stitching).
Automotive Subsystems: LiDAR interface boards, battery management system (BMS) supervisory PCBs (IPC-A-600 Class 3).
DFM/DFAsing Review Scope
24-hour turnaround engineering query report highlighting annular ring violations, acid traps, unanchored copper, and aspect ratio risks (>10:1 drill depth-to-diameter requires secondary evaluation).
Stackup Customization
Supply target impedance values (Z0) and stack height constraints; engineering generates impedance coupon design per layer.
Panelization
Customer-defined fiducials, tool holes (3.175mm), V-cut depth/web tolerances (0.3mm +/-0.05mm), or tab-routing with break-away mousebites.
Buffer Stock & VMI Management
Dedicated safety stock programs (customer-owned or fab-held bonded inventory) for long-lead specialized materials (Rogers / Megtron 6) to eliminate volume run line-stops.
Quality Control
Inspection & Test Gateways
AOI (Automated Optical Inspection): Inner layers post-etch, outer layers post-solder mask.
Flying Probe Test: Nets verified on 100% of prototypes (< net resistance thresholds).
E-Test (Fixture): Applied for batch runs >250 pcs.
Microsection Analysis: Destructive physical analysis per lot for plating thickness, barrel copper uniformity (>20 um min barrel wall for Class 3), and dielectric spacing.
Traceability
Laser-etched date code, batch tracking, and material COC (Certificate of Conformance) stored digitally per lot.
Plant Profile & Footprint:
Compliance Standards: ISO 9001:2015, IATF 16949 (secondary automotive scope), ISO 13485 (medical subset), UL E-file certified, RoHS/REACH compliant.
Packaging Standard: Vacuum-sealed anti-static ESD bags (<10^11 ohm/sq), silica gel desiccant packs, humidity indicator card (HIC), double-walled corrugated cartons with 50mm corner foam inserts. Baking protocol applied (120 degC for 4–24 hours) prior to vacuum seal if shelf-life window requires.
Logistics: FOB / EXW / DDP via DHL/FedEx Express (prototypes) or palletized air/sea freight (volume batch). Commercial invoice, packing list, COC, and microsection report included in shipment documentation.
Direct PE technical response within 4 working hours (auto-routed across GMT, CET, and EST coverage desks via
Required Input Checklist:
Gerber files (RS-274X) + Excellon drill file
Stackup requirement or target finished thickness (mm)
Surface finish selection (ENIG, OSP, etc.)
IPC Class requirement (Class 2 or Class 3)
Target volume (Prototype / Pilot / Annual forecast with VMI preference) and required delivery date
With abundant experience, we are one of the most professional multilayer pcbs manufacturers and suppliers in China. We warmly welcome you to buy bulk high quality multilayer pcbs for sale here from our factory. If you have any enquiry about cooperation, please feel free to email us.
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