The application scenarios for multilayer printed circuit boards span fields such as artificial intelligence and servers, telecommunications and 5G base stations, and automotive electronics. In the realms of AI and high-performance computing, the PCBs utilized in a single AI server unit typically range from 28 to 46 layers, with a board thickness of 4 to 5 mm. Telecommunications equipment-such as 5G base stations-widely employs multilayer PCBs; for instance, the 24-layer boards used in Huawei's 5G base stations achieve ultra-low-latency signal transmission through precision stacking designs. In the automotive electronics sector, multilayer PCB technology is applied in new energy vehicles and power devices; examples include AMB ceramic substrates-which utilize copper paste sintering technology to serve as heat dissipation bases for SiC power modules-and LiDAR DPC substrates, which support high-temperature-resistant packaging for vehicle-mounted radar systems.
In consumer electronics, devices such as smartphones, tablet computers, and wearable technology leverage the high-density routing capabilities of multilayer PCBs to achieve miniaturization, as well as thinner and lighter form factors. Within the aerospace and defense sectors, multilayer PCBs are utilized in flight control and communication/navigation systems; notably, the 40-layer boards employed by NASA in its Mars rovers feature polyimide dielectric materials and gold traces, enabling them to maintain signal integrity at temperatures as low as -120°C. Finally, in the field of industrial control and automation, the control boards for automated equipment-such as robots and CNC machine tools-rely on multilayer PCBs to facilitate precise control operations.
